Double SideTape For Contact Card Chip Thermoplastics Adhesive
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Double SideTape For Contact Card Chip Thermoplastics Adhesive Product Description Product: DS-4 Description: The hot melt adhesive isused for embedding of contact smart cards.Excellent adhesion toPVC ,FR-4 and other materials.This product belongs to hot-melt tape with low and medium temperature properties. Very strong cohesion and good flexibility to ensure that no structural fracture will occurin the thrustand bending test safter bonding,while maintaining a balanced bond strength with the chip and the card base,and has excellent punchability.Meet the requirements of ISO7816 standard for chip package fastness.
Applications:DS-4 issuit able for heat embedding of IC cards,SIM cards,financial social security cards and contact bankcards.
Composition: Polyamide synthetic modification Physical Characteristics:
2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.
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Packaging & Shipping packing: packing&shipping:200M/roll 20rolls/ctn shipping: 5-7days
1.Do you accept OEM or ODM? 5. How do I pay for my order?
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