Double sided Polyamide PA Hot Melt Adhesive Film for SIM Card
Hot Melt Adhesive Film Description
The hot melt adhesive is used for embedding of contact smart cards.
Excellent adhesion to PVC, FR-4 and other materials.This product
belongs to hot-melt tape with low and medium temperature
properties. Very strong cohesion and good flexibility to ensure
that no structural fracture will occur in the thrust and bending
tests after bonding, while maintaining a balanced bond strength
with the chip and the card base, and has excellent punchability.
Meet the requirements of ISO7816 standard for chip package
fastness.
Hot Melt Adhesive Film Technical Parameters:
Colour | Light Yellow | Release Protection | Glassine Release Paper |
Proportion | 1.08±0.02g/cm³ | Conventional Thickness | 0.055mm±0.008mm |
Melting Range | 70-95℃ (Tunsing DSC 214) | Conventional Width | 29.2mm |
Melt Flow Index | 75±25g/10min(ASTM D1238-04) | Conventional Length | 200m |
Hardness | D 58±2 (Shore ) | Finished Product | 0.055mm*29.2mm*200m |
Hot Melt Adhesive Film Technical Parameters:
Mechanical Mold Temperature | 140℃-160℃ | Mechanical Mold Temperature | 160℃-180℃ |
Adhesive Time | 0.6S-1.2S | Packing Time | 0.6S-1.2S |
Pressure | 0.25-0.4mpa | Pressure | 0.25-0.4mpa |
Hot Melt Adhesive Film Application
Customer feedback
Hot Melt Adhesive Film Package
It can ship by FedEX. It will need 5-7 days at usual. Also can by
sea and air.
20-30m free sample for you to testing, you just pay to the shipping
fee.
