DTF PU Hot Melt Adhesive Powder Low Melting Point For Heat Transfer

DTF PU Hot Melt Adhesive Powder Low Melting Point For Heat Transfer

Packaging and Storage Conditions:

1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.

2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.

1.Do you accept OEM or ODM?
Yes ,we accept OEM and ODM, we are professional heat transfer material manufacturer ,having more than 10years experience. able to assist you R&D new products. So if you need bonding some special materials, please don't hesitate to let us know.

2.How do you transport the products?
If you are not urgent, we usually transport by ship because it is the cheapest way. But for the West Asia area,
we deliver by train because there is no sea to ship. And for samples and urgent cargo, we transport it by air as it is the fastest way .Of course if you have other better idea about transport, we will accept it.

3. May I have your samples?
If you need some sample for reference, please let us know your fully address/ship
mode with courier ,and we will arrange sample for your reference.

4. How long is the lead time?
Sample lead time:3-7 days
Bulk lead time:7-10 days(depends on order quantity)
 

6. How do I pay for my order?

We accept  T/T , Paypal.