Heat Activation Hot Melt Adhesive Tape For Chip Modules Embedded Substrate

Heat Activation Hot Melt Adhesive Tape for Chip Modules Embedded PC / PVC /ABS Substrate

Physical Characteristics:

The hot melt adhesive is used in the encapsulation of contact smart card. Excellent adhesion to PVC, ABS, PC, FR-4 and other materials.

Quick detail:

This product belongs to large molecular weight structure type hot melt adhesive tape. The super-strong cohesive force ensures that the thrust and bending tests after bonding will not show any structural fracture while maintaining a balanced bond strength with the chip and the base. In line with ISO7816 standard for chip packaging fastness.

The conventional width of a roll fim is 200m, but the width can make on the customer's request.

Applications:
DS-4 is suitable for thermal packaging of IC card, SIM card, financial social security card and dual interface bank card

1, Bonding temperature and pressure as well as the time involved in the strength of the film to material. Bonding temperature must be close to the machine set the temperature, the pressure must be uniform, mold and pressure roller must be flat.
2, In different machinery and materials, the bonding conditions used will be different. The conditions marked here are only basic. The optimum bonding conditions should be made by creating suitable construction conditions for the particular application damage, direct or consequential, arising out of the use, misuse or inability to use the product.
 

Customer Feedback:

Packing and Shipping:
Packing: 100 yard in roll, 2 rolls in case
Shipping: 5-7days by Express (DHL, FedEx, USP and so on) and by air, and 30-40 days by sea.

Smart Cards India Expo 2018

Why Choose Us
1, more than 10 years experience in production.
2, well-known products: Sichuan Famous Brand.
3, Good quality control in production process: Quality Service AAA Grade Credit Enterprise
4, Excellent quality and Competitive price, OEM is available.
5, Stable supply: an extensive range of stock.
6, The whole process from material to end products is under supervision.

FAQ:
Q1) . What is hot melt adhesive tape?
A: It is just a tape, and the basic material is release paper. But the tape is solid in room temperature, when reach its melt point, it is able to bond other materials, Different materials of hot melt adhesive tape have different performances and different usages, we need understand your products needs, then recommend you right products,
Q2).Do you accept OEM or ODM?
Yes ,we accept OEM and ODM, we are professional heat transfer material manufacturer ,having more than 10years domestic sale experience, we are able to assist you R&D new products. So if you need bonding some special materials, please don’t hesitate to let us know,
Q3).How do you ship the products?
If you are not urgent, we usually transport by sea in large quantity, which is the cheapest shipping way. And for samples and urgent cargo, we transport it by air or by express, as it is the fastest way etc,
Q4). Do you provide free sample? And how many days it will take?
Yes, of course.we provide free 3-5Y sample for your testing only need you to pay the shipping cost. We will make the sample within 3 working days and it will take 3-7days on the transportation., then you will have more confidence in our product quality and service,
Q5). How long is the lead time?
Sample lead time: 1-3 days
Bulk lead time: 7-20days(depends on order quantity),
Q6). How do I pay for my order?
We usually accept L/C ,T/T ,Western Union , Paypal.

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