White Translucent Hot Melt Adhesive Tape Glassine Release Paper Physical Form
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Embedding Of Chip-modules Into Smart Cards Chip Module Hot Melt Adhesive Tape
Physical Characteristics:
The hot melt adhesive is used in the encapsulation of contact smart card.Excellent adhesion performance to PVC, ABS, PC, FR-4 materials;In addition, the high heat in the manufacturing process of the carbon-based laser bar code causes damage to the chip module, which prevents the heat and avoids the module thermal necrosis.
Quick detail: This product belongs to modified large molecular weight structure black hot - melt adhesive tape.Strong cohesive force ensures that the thrust and bending tests after bonding will not occur structural fracture;At the same time and chip and card to maintain a balanced bond strength.In line with ISO7816 standard for chip packaging fastness.
Applications: DS-5B is suitable for thermal packaging of IC cards, SIM cards, financial social security cards, and dual interface bank cards.
1, Bonding temperature and pressure as well as the time involved in
the strength of the film to material. Bonding temperature must be
close to the machine set the temperature, the pressure must be
uniform, mold and pressure roller must be flat.
In order to strengthen the management of quality , we purchase many kinds of test equipments. for example : Melt Flow Index Machine Differential Scanning Calorimetry Peel Force Tester High Low Temperature Tester Chamber Bend Distortion Tester Thrust Tester
Our company has passed ISO9001:2015 quality management system certification, and all products in our company are up to RoHS,REACH, Oeko-tex, California Proposition 65, Halogen Test Report, PFOA, PFOS, PAHS, HBCDD and other environmental standards.
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Product Tags: hot melt adhesive film thermal adhesive tape |
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