IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent
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Bonding Temperature 160-180 Degree Card Smart Adhesive Tape for IC cards SIM cards
Description:
The hot melt adhesive is used in the encapsulation of contact smart
card. Excellent adhesion to PVC, FR-4 and other materials.
Product Image:
Composition: Polyamide synthesis modification Physical Characteristics:
Recommended Bonding Conditions:
Applications:
In order to strengthen the management of quality , we purchase many kinds of test equipments. for example : Melt Flow Index Machine Differential Scanning Calorimetry Peel Force Tester High Low Temperature Tester Chamber Bend Distortion Tester Thrust Tester
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| Product Tags: thermal adhesive tape pressure sensitive adhesive tape |
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