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rigid pcb smt placement equipment
Selling leads
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... vision camera: Improve recognition performance, size up to 40*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with ...
2025-08-02 00:07:26
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...SMT CE CCC SIRA pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40 mm large ...
2025-08-02 00:07:26
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... new flight vision camera: Improve recognition performance, size up to 10 mm*10 mm; Vacuum sensing device: Each placement head with independent ...
2025-06-08 05:31:19
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... vision camera: Improve recognition performance, size up to 40*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with ...
2025-08-02 00:07:26
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... flight vision camera improve recognition performance, size up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with ...
2025-06-08 05:31:19
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...SMT Machine Features 1.High speed and intelligent, ultra performance adopt high speed multi modular head, apply to ultra small chip 0201-40*40mm ...
2025-08-02 00:07:26
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...SMT Machine Features 1.High speed and intelligent, ultra performance adopt high speed multi modular head, apply to ultra small chip 0201-40*40mm ...
2025-08-02 00:07:26
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...SMT Machine Features 1.High speed and intelligent, ultra performance adopt high speed multi modular head, apply to ultra small chip 0201-40*40mm ...
2025-08-02 00:07:26
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...SMT Machine Features 1.High speed and intelligent, ultra performance adopt high speed multi modular head, apply to ultra small chip 0201-40*40mm ...
2025-08-02 00:07:26
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...SMT Machine Features 1.High speed and intelligent, ultra performance adopt high speed multi modular head, apply to ultra small chip 0201-40*40mm ...
2025-08-02 00:07:26
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