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...placement head Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40mm large chip, wider component range; ...
2025-06-08 05:31:19
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...placement machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wider component range...
2025-07-14 00:08:04
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... vision camera: Improve recognition performance, size up to 40*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with ...
2025-07-14 00:08:04
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... vision camera: Improve recognition performance, size up to 40*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with ...
2025-07-14 00:08:04
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... flight vision camera improve recognition performance, size up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with ...
2025-06-08 05:31:19
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... flight vision camera improve recognition performance, size up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with ...
2025-06-08 05:31:19
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... flight vision camera improve recognition performance, size up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with ...
2025-06-08 05:31:19
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... multi-integrated machine,breaking through industry conventions, greatly improving mounting speed, accuracy and stability. Vacuum Sensing Device ...
2025-07-14 00:08:03
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Product Description: 1. Features: Apply to 1m, 5m, 50m, 100m, 500m any length of LED soft flexible lamp strip etc. Apply to LED chip 3014, 3528, 2835, ...
2025-06-08 05:31:19
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... PCB making machine E6T SMT pick and place machine,LED light making machine,LED light production machine. Product Description 1.Dual vision system ...
2025-06-08 05:31:19
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