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multi modular head pick place machine
Selling leads
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...pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wider component ...
2025-06-08 05:31:19
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... chip, wider component range improve recognition performance size up to 40*40mm, apply to BGA 0R CSP etc. each placement head with independent ...
2025-07-14 00:08:04
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... recognition performance, size up to 40*40mm. (3) each module 20 spindles, both high speed and intelligent with light compact design. (4) each ...
2025-07-14 00:08:04
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... making machine use ten mounting heads, equipped with high-precision components recognition system, on-line production, RT-1 independent research ...
2025-07-14 00:08:04
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... range; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the ...
2025-07-14 00:08:04
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...Series Pick and Place Machine Min Can Mount 0201~10*10mm Components Machine main features Adopt High speed multi modular head, apply to ultra small ...
2025-07-14 00:08:04
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... range; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the ...
2025-07-14 00:08:04
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... camera: Improve recognition performance, size up to 40*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent ...
2025-06-08 05:31:19
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...pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40 mm large chip, wide ...
2025-06-08 05:31:19
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...pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40 mm large chip, wide ...
2025-07-14 00:08:04
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