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modular head led chip mounter
Selling leads
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...*40mm large chip, wider component range improve recognition performance size up to 40*40mm, apply to BGA 0R CSP etc. each placement head with ...
2026-05-31 00:10:15
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... range; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the ...
2026-05-31 00:10:15
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... camera: Improve recognition performance, size up to 40*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent ...
2026-05-31 00:10:15
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...speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wide component range; Brand new flight vision camera: Improve recognitio...
2026-05-31 00:10:15
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... speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wide component range; Brand new flight vision camera: Improve ...
2025-06-08 05:31:19
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... flight vision camera: Improve recognition performance, size up to 10 mm*10 mm; Vacuum sensing device: Each placement head with independent ...
2025-06-08 05:31:19
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... flight vision camera: Improve recognition performance, size up to 10 mm*10 mm; Vacuum sensing device: Each placement head with independent ...
2025-06-08 05:31:19
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...speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wider component range; Brand new flight vision camera: Improve ...
2026-05-31 00:10:15
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...speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wider component range; Brand new flight vision camera: Improve ...
2026-05-31 00:10:15
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... camera: Improve recognition performance, size up to 40*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent ...
2026-05-31 00:10:15
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