371 - 380 of 715
ic component pick and place equipment
Selling leads
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... up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the ...
2025-06-08 05:31:19
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...*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of ...
2026-06-01 00:08:24
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...pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40 mm large chip, wide ...
2025-06-08 05:31:19
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...*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of ...
2026-06-01 00:08:24
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...pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40 mm large chip, wide ...
2026-06-01 00:08:24
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...pick and place machine Description Adopt High speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wide component range; ...
2026-06-01 00:08:24
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...pick and place machine Description Adopt High speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wide component range; ...
2025-06-08 05:31:19
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...pick and place machine Description Adopt High speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wide component range; ...
2025-06-08 05:31:19
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..., size up to 10 mm*10 mm; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the ...
2025-06-08 05:31:19
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...*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of ...
2026-06-01 00:08:24
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