811 - 820 of 913
90000cph pcb placement equipment
Selling leads
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...widercomponent range; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment ...
2026-06-01 00:08:24
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... range; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the ...
2026-06-01 00:08:24
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... large chip, wider component range improve recognition performance size up to 40*40mm, apply to BGA 0R CSP etc. each placement head with independen...
2026-06-01 00:08:24
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... range; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the ...
2026-06-01 00:08:24
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...to 40*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the stability ...
2025-06-08 05:31:19
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... vision camera: Improve recognition performance, size up to 40*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with ...
2025-06-08 05:31:19
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... flight vision camera improve recognition performance, size up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with ...
2025-06-08 05:31:19
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... flight vision camera improve recognition performance, size up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with ...
2025-06-08 05:31:19
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...Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the reliability ...
2025-06-08 05:31:19
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...Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the reliability ...
2025-06-08 05:31:19
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