Main process flow of SMT

• What are the elements of the SMT placement machine placing process?
• Printing solder paste: Use wire mesh to leak solder paste onto PCB pads in preparation for component welding. The equipment required for this process is a solder paste printing machine, which is divided into fully automatic and semi-automatic.

• Mounting: The equipment required for accurately installing surface mounted components to their corresponding fixed positions on the PCB is a placement machine.

• Furnace welding:The purpose is to melt the solder paste so that the components on its surface can be combined with the PCB board. The required equipment is a reflow oven.

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