BGA CSP PLCC PCB SMT Mounting Machine 80000CPH 64 PCS Docking Cart Slot

BGA, CSP, PLCC PCB driver boaed mounting machine with 80000CPH 64 PCS docking cart slot

Product description

YT202S SMT pick and place machine, The theoretical speed of YT202s is 80000 CPH, First of all, from the appearance of the machine, these two modules are roughly the same. The biggest difference is that yt202s has two mounting heads.

When the machine works, they work for two different PCBs respectively. Two products can be produced at the same time. One side stops working and the other side continues working. They are controlled independently. Very intelligent.

the main guide rail of yt202s is also a high-end magnetic linear motor. it has high accuracy.

Feature

The high-precision magnetic linear motor, which is used to improve the stability, speed and accuracy of machine placement.

This is Grating scale, It is a detection device, which determines the accuracy of the head placement to a certain extent.

Drag Chain, The function is to protect the wires from abrasion and prolong the service life of the machine.

Our YT202 pick and place machine has 4 cameras, one module has 2 cameras, It is a flight recognition camera and the Mark camera. This is the flight recognition camera, and this is the Mark camera. Their role is to improve The accuracy of machine placement. This is also one of the reasons why our multifunction machines can mount precision components.

Each placement head of this multifunctional machine is controlled by an independent servo motor, which can mount different components.

our industrial computer, the software is independently developed by ETON, with a Chinese and English operation interface, and the operation is simple and easy to understand.

Parameter

X-ray inspection in the PCB industry

In recent years, BGA, QFN, CSP, flip-chip and other area array components have been widely used in electronic manufacturing. Such as BGA, compared with other components, it has smaller pin count, inter-pin inductance and capacitance, and better heat dissipation. However, BGA also has shortcomings. For example, after SMT, it is difficult to judge the soldering quality of the solder joints under the package by the naked eye or AOI test.

X-ray equipment is based on the strong penetration of X-rays. The lamp tube emits X-rays under high pressure, which can effectively penetrate the object to be measured. The image performance is diversified due to different density and thickness, so as to realize the detection of solder joints. To ensure solder quality, more and more manufacturers are opting for X-ray inspection of components that hide solder joints.