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Shenzhen CN Technology Co. Ltd..
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Vacuum reflow soldering

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Shenzhen CN Technology Co. Ltd..

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-135-3787-5415

Contact Person:
Mrs.lizzy
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Vacuum reflow soldering

Minimum Order Quantity 1 set of machine or mixed order is also acceptable
Price Negotiable
Payment Terms L/C,D/A,D/P,T/T,Western Union,MoneyGram
Delivery Time 5-8 Working days
Packaging Details Standard export boxes and sturdy hardwood packages are both options
Detailed Product Description

Vacuum reflow soldering

 

The Vacuum Reflow Soldering machine is a high-tech oven designed for soldering electronic components onto circuit boards with exceptional precision and reliability. Available in different models like the KTZ-8N and KTZ-10N, it uses a controlled heating and cooling process, sometimes with nitrogen, to create strong, void-free solder joints. This machine is ideal for industries requiring high-quality soldering, such as military, aerospace, automotive, and LED manufacturing. It features a user-friendly control system, adjustable conveyor, and an optional vacuum chamber to further reduce defects. With its ability to handle various board sizes and component heights, this soldering oven ensures consistent and dependable results for a wide range of electronic products.

 

 

Parameter KTZ-8N KTZ-10N
Dimensions (L x W x H) L6400 x W1695 x H1650 mm L7170 x W1695 x H1650 mm
Weight 3000 kg 3500 kg
Color Computer Grey Computer Grey
Heating Zones 8 Zones (Top) / 8 Zones (Bottom) 10 Zones (Top) / 10 Zones (Bottom)
Heating Zone Length 3110 mm 3892 mm
Cooling Zones 3 Zones (Top) / 3 Zones (Bottom) 3 Zones (Top) / 3 Zones (Bottom)
Rectifying Plate Structure Small Circulation Small Circulation
Exhaust Volume Requirement 11 m³/min x 2 (per channel) 12 m³/min x 2 (per channel)
Power Supply 3-Phase, 380V, 50/60 Hz (Optional: 220V) 3-Phase, 380V, 50/60 Hz (Optional: 220V)
Total Power 67 kW 83 kW
Startup Power 32 kW 38 kW
Normal Power Consumption 10 kW 11 kW
Warm-Up Time (Approx.) 20-25 minutes 20-25 minutes
Temperature Range Ambient to 300°C Ambient to 300°C
Temperature Control PID Closed-Loop + SSR Driving (PC + PLC) PID Closed-Loop + SSR Driving (PC + PLC)
Temperature Accuracy ±1°C ±1°C
PCB Temperature Deviation ±1°C ±1°C
Data Storage Configurable Production Parameters & Status Configurable Production Parameters & Status
Alarm System Temperature Anomaly, Board Drop Temperature Anomaly, Board Drop
Alarm Indication Tri-Color Indicator (Yellow, Green, Red) Tri-Color Indicator (Yellow, Green, Red)
Rail Structure Three Independent Rails Three Independent Rails
Chain Mechanism Anti-Jamming Single Chain Buckle Anti-Jamming Single Chain Buckle
Maximum PCB Width 150mm x 150mm; 400mm x 400mm 150mm x 150mm; 400mm x 400mm
Rail Width Adjustment 50-400 mm 50-400 mm
Component Height (Max) 30 mm (Top), 30 mm (Bottom) 30 mm (Top), 30 mm (Bottom)
Conveyor Direction Left-to-Right (Optional: Right-to-Left) Left-to-Right (Optional: Right-to-Left)
Rail Fixation Front Rail Fixed Front Rail Fixed
PCB Transport Rail + Chain Conveyor Rail + Chain Conveyor
Conveyor Height 900 ± 20 mm 900 ± 20 mm
Conveyor Speed 300-2000 mm/min 300-2000 mm/min
Lubrication Automated High-Temperature Lubricant System Automated High-Temperature Lubricant System
Width Adjustment Synchronized Three-Sectional Adjustment Synchronized Three-Sectional Adjustment
Conveyor System Independent Conveyor Independent Conveyor
Ultimate Vacuum Pressure 10 Pa 10 Pa
Vacuum Extraction Four Independent Stages Four Independent Stages
Cooling Method Forced Air Water Chiller
Nitrogen System (Optional) Enclosed System with Flow Meter & Chiller Enclosed System with Flow Meter & Chiller
Nitrogen Consumption 300-1000 ppm (with 400mm Conveyor) 300-1000 ppm (with 400mm Conveyor)
Anti-Stuck Feature Automatic PCB Thickness Adaption Automatic PCB Thickness Adaption
Soldering Performance Metrics
Metric Specification
High-Power Component Void Rate Single Void Rate < 1%, Total Void Rate < 3%
High-Lead SMT Void Rate (X-Ray) Single Void Rate < 1%
Target Applications
  • Military Electronics
  • Aerospace Electronics
  • Automotive Electronics
  • High-Power LED Products
  • IGBT Packaging
Key Changes and Explanations:
  • Formal Language: Replaced informal terms with more precise and technical language (e.g., "Warm-up Time" instead of "Warming time," "Automated Lubricant System" instead of "Auto-lubrication").
  • Units Included: Added units to all numerical specifications for clarity (e.g., mm, kg, kW, °C).
  • Clearer Headings: Used more descriptive headings for each section and parameter.
  • Consistency: Ensured consistent terminology throughout the table.
  • Detailed Descriptions: Expanded descriptions where necessary to provide more context.
  • Separate Sections: Divided the table into sections for overall specifications, soldering performance, and target applications to improve readability.
  • Metric Table: Created a separate table for soldering performance metrics to highlight these important values.
  • Replaced "Abnormal Alarm" with "Alarm System": This is more concise and professional.
  • Replaced "Board Dropping Alarm" with "Alarm Indication": This is more specific and technically accurate.

 

Soldering performance with high-power components: individual void rate is less than 1%, and the overall void rate is less than 3%.

 

 

Exceptional soldering performance is achieved with high-lead SMT components. X-ray testing reveals a single void rate consistently below 1%

 

 

 

Test the effect of automotive electronic product mounting and soldering.

 

 

 

 

Test effect of vacuum soldering of chips for military, aerospace&aviation electronic products and tin sheets.

 

 

Product Tags: vacuum reflow soldering machine   SMT reflow soldering equipment   vacuum soldering system for SMT  
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