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Shenzhen Qianhai Lensen Technology Co., Ltd
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1OZ Copper High Density PCB FR4 TG170 Multilayer Circuit Board

1OZ Copper High Density PCB FR4 TG170 Multilayer Circuit Board

Brand Name Lensen
Certification CE
Place of Origin China
Layer 6L
Base Material FR4 TG170
Board Thickness 1.54mm
Final Copper Thickness 1OZ
Detailed Product Description

High density PCB Multilayer PCB China PCB factory

High density PCB
Special Request: Blind buried via
Layer: 6L
Base Material: FR4 TG170
Board Thickness: 1.54mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 90.0*50.0
Panel Size(mm): 195.0*102.0
Min W/S(mil): 3.4*5.37
Min Hole Size: 0.15mm
Special Request: Impedance Control

Product Tags: 1OZ Copper High Density PCB   Impedance Control High Density PCB   FR4 TG170 Multilayer Circuit Board  
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