High Bonding Strength Thermal Conductive Glue Electronic Epoxy Resin Adhesive
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Thermal Conductive Glue Electronic Epoxy Resin Adhesive
TIE™280--12AB is a two-component, high thermal conductivity, room-temperature curing, long working time and fireproof epoxy resin potting compound, which is especially suitable for potting capacitors and small electronic devices.
Product Summary:
TIE™280-12AB is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
TIE280-12AB-Series-Datasheet.pdf
Feature
Applications
Application Features: TIE™380-12A Color Black Viscosity@25℃ 15,000 cPs Shelf life @25℃° 12Months
TIE™380-12B Color Black Viscosity@25℃ 7,000 cPs Shelf life @25℃° 12Months
TIE™380-12AB(Two Component Mix) Viscosity(@25℃ )1,000 cPs Operating time9(@ 25℃)45Minutes Specific Gravity (@25℃) 1.6 g/cc
Shelf life( @25℃°) 12Months
Curing procedures: Curing temperature Curing time 25℃° 3 Hours 70℃ 30Minutes
Package:
1KG A/B for each tank. 5KG A/B each. 10KG A/B each.
Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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| Product Tags: Electronic Epoxy Resin Glue Electronic Thermal Conductive Glue Electronic Epoxy Resin Adhesive | |||||||||||||||||||||||||||||||||||||||||||||||
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