High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance
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2022 high thermal conductivity thermal conductive epoxy glue good adhesive for bonding electronics
TIE™380-25High Performance Thermal Conductivity Of The Epoxy Adhesive
Product Summary:
TIE™380-25 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling
Feature
Applications
Application Features:TIE™380-25
Color Gray Viscosity@25℃ 140,000 cPs Specific Gravity@25℃ 2.1 g/cc Shelf life @25℃° 10 Days @0℃° 6 Months (Storage methods and temperature will affect the shelf life)
Curing procedures: Curing temperature Curing time 100℃° 3 Hours 125℃ 1.5 Hour 150℃ 20 Minutes 170℃ 5 Minutes
Package: 1kg/can
Ziitek Culture
Quality : Do it right the first time, total quality control Effectiveness: Work precisely and thoroughly for effectiveness Service: Quick response, On time delivery and Excellent service Team work: Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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| Product Tags: high heat epoxy glue heat resistant epoxy glue Thermal Epoxy Glue 2.5 W/mK | |||||||||||||||||||||||||||||||||||||||||||||||
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