Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
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Two Components 1.0W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
TIS™ 680-10AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
TIS680-10AB-Specification-sheet.pdf
Features
> Good thermal conductive: 1.0W/mK > Excellent insulation and smoothly sourface. > Low shrinkage > Low viscosity, expediting air releaseed. > Excellent in solvents and water proof. > Longer life time. > Excellent thermal shock efficiecy and impact resistance
Application
>To potting LED Lighting heat spreader and power- driver. >Relay sealant; Good adhesion to rubber, ceramics, PCB and plastics >Power transformers and coils; Potting capacitors; Potting of
small electrical devices
Product packaging 1KG A/B for each tank. 5KG A/B each. 10KG A/B each. Company profile Ziitek company is a high-tech enterprise which dedicated to the
R&D, manufacture and sales of the thermal interface materials
(TIMs). We have rich experiences in this field which can support
you the latest, most effective and one -step thermal management
solutions. We have many advanced production equipments,full test
equipments and fully automatic coating production lines which can
support the production for high performance thermal silicone pad,
thermal graphite sheet/ film, thermal double-sided tape, thermal
insulation pad, thermal ceramic pad, phase change material, thermal
grease etc. UL94 V-0, SGS and ROHS are compliant.
Certifications:
ISO9001:2015 ISO14001: 2004 IATF16949:2016 IECQ QC 080000:2017 UL |
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| Product Tags: high voltage potting compound epoxy resin potting compound 1.2W/MK thermal potting compound | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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