China Die Cut Adhesive Tape manufacturer
SZ PUFENG PACKING MATERIAL LIMITED
SHENZHEN PUFENG PACKING MATERIAL CO.,LTD SZ PUFENG PACKING MATERIAL LIMITED
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epdm waterproof buffer material

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SZ PUFENG PACKING MATERIAL LIMITED

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27218853

Contact Person:
Ms.Yuna Qin
View Contact Details
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epdm waterproof buffer material

Selling leads
...material with excellent resistance to compressive permanent deformation and provides shock and shock management. Such durable materials maintain ... 2025-05-13 10:28:41
...material Product Description: It is a high-performance reflective material. It adopts the micro-crystalline cube reflection technology. Under the ... 2025-07-03 19:13:36
...Material Pe foam tape polyethylene tape+ acrylic adhesive Color White, Black size: 1020mm X 30M according to your requirement Usage Permanent ... 2024-12-09 12:31:58
... viscosity and holding viscosity 2. Easy die cutting, good stability 3. The release paper has the effect of anti-sticking, anti-oil and waterproof, ... 2025-11-04 21:53:49
...Sensitive Tape Product features/Applications: Easy to use, firm paste. It is waterproof, moisture-proof and corrosion-resistant. It is often used ... 2026-02-10 20:56:42
... sensitive adhesive. Product features/Applications: The surface is smooth and resistant to wear. It has excellent waterproof and temperature ... 2026-06-21 00:31:52
...Product description : The base material is PVC film with a bright surface layer and is coated with rubber-type pressure sensitive adhesive. Product ... 2024-12-09 21:38:26
...sensitive adhesive. Product Features: Wear-resistant and scratch-resistant to meet the requirements of long-term use. Good waterproof performance, ... 2025-06-20 18:02:57
..., plastic, foam products,. For demanding paste applications; Component paste. PRODUCT PARAMETERS Brand TESA Model 61350 Base material PET film ... 2026-05-13 19:12:05
...waterproof, temperature resistance, weather resistance and moisture resistance. Strong holding force. Used for bonding of various electronic ... 2026-06-05 14:29:18
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