Quartz Wafer Boat High-Purity & High-Temperature Resistant Customizable

Product Introduction

A wafer boat, also known as a boat or carrier, is a critical tool in semiconductor manufacturing for holding, transferring, and positioning wafers. Its design must withstand extreme conditions such as high temperatures (>1000℃), chemical corrosion, and electrostatic discharge (ESD) to ensure wafer safety during various processes.

Principle

​​Alignment & Fixation​​:
​​Positioning holes​​ on the boat align with pins in the wafer cassette, enabling batch transfer without manual handling.
​​Dual-layer slots​​ (upper and lower) secure wafers during thermal cycling (e.g., annealing) .

​​Thermal Stress Management​​:
​​Low thermal expansion material​​ (0.5×10⁻⁶/°C) minimizes warpage under temperature fluctuations .
​​Honeycomb structure​​ distributes thermal stress evenly .

​​Process Compatibility​​:
​​Slot geometries​​ (e.g., I-type, V-type) accommodate varying wafer thicknesses (300–800 μm) while ensuring gas-phase reactant flow .
​​Diamond-shaped cross-section​​ allows bidirectional robotic loading, improving throughput.

​​Safety & Protection​​:
​​Buffer components​​ (springs, rubber pads) absorb mechanical shocks during wafer placement .
​​Nitrogen purging​​ removes residues, preventing contamination

Characteristics

Fused silica glass is a specialized industrial glass made from silicon dioxide (SiO₂). It serves as an exceptional base material with outstanding physical and chemical properties.

• ​​High-Temperature Resistance​​:

Softening point: ~1730°C.
Operates continuously at 1100–1250°C and withstands short-term exposure up to 1450°C .

• ​​Chemical Inertness​​:

Resistant to most acids (except hydrofluoric acid).
Corrosion resistance is ​​30× higher than ceramics​​ and ​​150× higher than stainless steel​​ .
Maintains stability under extreme thermal conditions, outperforming other materials .

• ​​Thermal Stability​​:

Extremely low thermal expansion coefficient (~5.5×10⁻⁷/°C).
Survives thermal shock (e.g., heating to 1100°C and quenching in water) .

• ​​Optical Transparency​​:

Broad spectral transmission from ultraviolet (UV) to infrared (IR).
Visible light transmittance: >95%.
UV transmittance peaks at >85% in the 185–250 nm range .

• ​​Electrical Insulation​​:

Resistivity is ​​10,000× higher​​ than ordinary glass.
Excellent dielectric properties even at high temperatures .

Applications