Titanium Cylindrical Sputtering Targets,Titanium Rotating Cylinder
Target Thin Film Deposition, Magnetron high purity Rotatory Titanium sputtering targets with the highest
possible density and smallest possible average grain sizes for use
in semiconductor, chemical vapor deposition (CVD) and physical
vapor deposition (PVD) display and optical applications. Specification Composition | Ti | Purity | CP Grade 2 (99.5%), CP Grade 1 (99.7%), 3N5 (99.95%), 4N (99.99%), 4N5 (99.995%) | Density | 4.51 g/cm3 | Grain Sizes | < 50 micron or on request | Fabrication Processes | Vacuum Melting, Forging, Extruding, Machining | Shape | Straight, Dog Bone | End Types | SCI, SRF, DSF, RFF, WFF, VA, GPI Ends Fixation, Spiral Groove,
Custom Made | Surface | Ra 1.6 Micron or on request |
Related Magnetron sputtering rotating target Magnetron sputtering target,/rotating target (tube target) | | | | | | Item | purity | Density | shape | Dimension(mm) | | TiAl target | 2N8-4N | 3.6-4.2 | Tube,disc,plate | OD70 x T 7 x L Other as customized | | Cr target | 2N7-4N | 7.19 | Tube,disc,plate | OD80 X T8 X L Other as customized | | Ti target | 2N8-4N | 4.51 | Tube,disc,plate | OD127 x ID105 x L OD219 x ID194 x L OD300 x ID155 x L Other as customized | | Zr Target | 2N5-4N | 6.5 | Tube,disc,plate | Other as customized | | Al target | 4N-5N | 2.8 | Tube,disc,plate | | | Ni target | 3N-4N | 8.9 | Tube,disc,plate | | | Cu target (copper ) | 3N-4N5 | 8.92 | Tube,disc,plate | | | Cu target (brass) | 3N-4N5 | 8.92 | Tube,disc,plate | | | Ta target | 3N5-4N | 16.68 | Tube,disc,plate | OD146xID136x299.67(3pcs) | |
Titanium Cylindrical Sputtering Targets Picture:
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