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Copper Rotatable Sputtering Target High Density With Smooth Surface

Copper Rotatable Sputtering Target High Density With Smooth Surface

Brand Name JINXING
Model Number Copper Rotatable Sputtering Target
Certification ISO 9001
Place of Origin China
Minimum Order Quantity 1kg
Price 15~100USD/kg
Payment Terms L/C, D/A, D/P, T/T, Western Union
Supply Ability 100000kgs/M
Delivery Time 10~25 work days
Packaging Details Plywood case
Material Copper
Process CIP, HIP Pressing
Size Customized
Application PVD Coating,
Density 8.96g/cm3
Shape Round , Plate , Tube ,Rotatable Sputtering Target
Grain Size Fine Grain Size, Good density
Purity 99.999%, 99.9999%
Detailed Product Description

Copper Rotatable Sputtering Target Ultra high purity 99.999%, 99.9999%

6N ultra-high purity electrolytic copper is mainly used in the production of sputtering target, evaporation film and anode materials for integrated circuits.

 

Purity: 99.999% ~ 99.9999%

For precise control of impurity content, Ag content can be controlled below 0.1ppm and s content below 0.02ppm

 

The content of gas elements (C, O, N, H) is less than 1ppm

Main uses: 6N copper has some properties similar to gold, good conductivity, ductility, corrosion resistance and surface performance, and low softening temperature. As a new kind of material, high-purity copper is not only used in the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets for liquid crystal display and ion coating, but also an indispensable and precious material in the atomic energy, rocket, missile, aviation, aerospace and metallurgical industries . As a new material, ultra pure copper has been paid more and more attention. In addition to the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets and ion coating for liquid crystal display, high-quality audio circuits and other high-tech fields, high-purity copper is also used in atomic energy, rockets, missiles, aviation, space navigation and other fields Precious materials are indispensable in metallurgical industry. With the development of high and new technology and the need of strategic materials, high-purity metals have higher and higher requirements for purity. The preparation and application of high-purity and ultra-high-purity metals in modern materials science and engineering are new and growing fields.

 

Among the production methods of high-purity copper, electrolytic refining technology is the most mature, widely used and the most promising method in industry. The key technology of electrolytic refining to produce high purity copper is to highly purify the electrolyte. The raw material is the cathode copper obtained by the general electrolytic plant. The purity of copper is improved by RE Electrolysis 

 

Copper Rotatable Sputtering Target 99.9999% , Copper Tu beSputtering Target 99.9999% are available in varying sizes

Sizes:

 

Plate sputtering targets:

 

Thickness: 0.04 to 1.40" (1.0 to 35mm).

Width up to 20"(50 to 500mm).

Length: 3.9" to 6.56 feet( 100-2000mm)

other sizes as requested.

 

Cylinder sputtering targets:

 

3.94 Dia. x 1.58"(100 Dia. x 40mm)

2.56 Dia. x 1.58" (65 Dia. x 40mm)

or 63*32mm other sizes as requested.

 

Rotatable sputtering targets:

 

2.76 OD x 0.28 WT x 39.4”L (70 OD x 7 WT x 1000mm L)

3.46 OD x 0.39 WT x 48.4”L (88 OD x 10 WT x 1230mm L)

other sizes as requested.

 

Advantage: 

 

1. Purity: 99.99% ~ 99.9999%

2. High density, no defects inside, even grains and smooth surface

3. Unique melting and casting pollution control process

4. It can meet the needs of customized alloy

5. Unique homogenization control technology of added elements

6. Unified microstructure control

 

 

 
Product NameElementPurirtyMelting Point Density (g/cc)Available Shapes
High Pure SliverAg4N-5N96110.49Wire, Sheet, Particle, Target
High Pure AluminumAl4N-6N6602.7Wire, Sheet, Particle, Target
High Pure GoldAu4N-5N106219.32Wire, Sheet, Particle, Target
High Pure BismuthBi5N-6N271.49.79Particle, Target
High Pure CadmiumCd5N-7N321.18.65Particle, Target
High Pure CobaltCo4N14958.9Particle, Target
High Pure ChromiumCr3N-4N18907.2Particle, Target
High Pure CopperCu3N-6N10838.92Wire, Sheet, Particle, Target
High Pure FerroFe3N-4N15357.86Particle, Target
High Pure GermaniumGe5N-6N9375.35Particle, Target
High Pure IndiumIn5N-6N1577.3Particle, Target
High Pure MagnesiumMg4N6511.74Wire, Particle, Target
High Pure MagnesiumMn3N12447.2Wire, Particle, Target
High Pure MolybdenumMo4N261710.22Wire, Sheet, Particle, Target
High Pure NiobiumNb4N24688.55Wire, Target
High Pure NickelNi3N-5N14538.9Wire, Sheet, Particle, Target
High Pure LeadPb4N-6N32811.34Particle, Target
High Pure PalladiumPd3N-4N155512.02Wire, Sheet, Particle, Target
High Pure PlatinumPt3N-4N177421.5Wire, Sheet, Particle, Target
High Pure SiliconSi5N-7N14102.42Particle, Target
High Pure TinSn5N-6N2327.75Wire, Particle, Target
High Pure TantalumTa4N299616.6Wire, Sheet, Particle, Target
High Pure TelluriumTe4N-6N4256.25Particle, Target
High Pure TitaniumTi4N-5N16754.5Wire, Particle, Target
High Pure TungstenW3N5-4N341019.3Wire, Sheet, Particle, Target
High Pure ZincZn4N-6N4197.14Wire, Sheet, Particle, Target
High Pure ZirconiumZr4N14776.4Wire, Sheet, Particle, Target

Product Tags: Copper Rotatable Sputtering Target   Sputtering Target With Smooth Surface   Copper Sputtering Target High Density  
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