Titanium Plate Sputtering Targets High Purity For Semiconductor Chips

Titanium Plate Sputtering Target high purity 99.99%, 99.999%

High purity material, ultra-high purity material, semiconductor high purity material

Products include low oxygen ultra-high purity titanium material, high-end titanium alloy material, production equipment and process development of low oxygen ultra-fine (spherical) Ti powder and Ti alloy powder, advanced metal pressure processing technology, process development of low-cost Ti, near net forming processing technology (additive manufacturing, precision casting). It is widely used in the purification and preparation of ultra-high purity metal materials for semiconductors, the preparation and processing of high-end titanium alloys for aviation, offshore oil, green energy, medical devices and other fields.

Titanium is widely used in various fields of modern industry because of its superior comprehensive properties. However, titanium with ordinary purity is far from meeting the most advanced technical requirements in the core strategic fields such as semiconductor integrated circuit, aerospace, military industry, medical treatment, petrochemical industry, etc. From 99.98% to 99.999%, although there is only a little bit in the number, it has made a qualitative leap. Only ultra-high pure titanium can meet the raw material requirements of many modern industries and advanced processing technologies, such as sputtering target materials for semiconductor chips, high-end titanium alloy for aerospace, high-end titanium powder for 3D printing, etc

Application field of sputtering coating: Sputtering coating is widely used in packaging coating, decoration coating, architectural glass coating, automobile glass coating, low radiation glass coating, flat panel display, optical communication / optical industry, optical data storage industry, optical data storage industry, magnetic data storage industry, optical coating, semiconductor field, automation, solar energy, medical treatment, self lubrication film, capacitor Device coating, other functional coating, etc. (click to enter the detailed introduction)

Sputtering target backplane supply, bonding service: the center provides a variety of sputtering target backplane, including oxygen-free copper, molybdenum, aluminum, stainless steel and other materials. At the same time, it provides the welding service between the target and the back plate.