Semiconductor Industry 1A1 Centerless Grinding Wheel Resin Bond
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Detailed Product Description
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Semiconductor Industry 1A1 Centerless Grinding Wheel Resin Bond
Centerless Grinding Wheel Introduction
Centerless Grinding Wheel differs from centered grinding operations in that no spindle or fixture is used to locate and secure the workpiece; the workpiece is secured between two rotary grinding wheels, and the speed of their rotation relative to each other determines the rate at which material is removed from the workpiece.
Features of Centerless Grinding Wheel : Resin: High efficiency grinding in one batch, good sharpness, long using life Vitrified: high efficiency and good shape retention
Specification:
Application
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| Product Tags: 1A1 Centerless Grinding Wheel Semiconductor Centerless Grinding Wheel 1A1 regulating wheel centerless grinding |
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