Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries
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Detailed Product Description
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Centerless Wheels
Centerless grinding is a machining process that uses abrasive cutting to remove material from a workpiece. Centerless grinding differs from centered grinding operations in that no spindle or fixture is used to locate and secure the workpiece; the workpiece is secured between two rotary grinding wheels, and the speed of their rotation relative to each other determines the rate at which material is removed from the workpiece.
Features: Resin: High efficiency grinding in one batch, good sharpness, long using life Vitrified: high efficiency and good shape retention
Specification:
Application
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| Product Tags: pcd cutting tool blanks diamond bruting wheel |
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