High Performance Grinding Wheel For Semiconductor And Photoelectricity
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Detailed Product Description
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Resin Bond Back Thinning Wheels
The back thinning is performed by a wet grind process with a rust inhibitor for cooling the chips and keeping the grind wheel free of debris. The grinding wheel acts a very important role in the grinding process, a low quality grinding wheel will lead high reject rate.
Features:
Specification:
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| Product Tags: pcd cutting tool blanks pcd die blanks | |||||||||||||||||||||||||||
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