China Diamond Grinding Wheel manufacturer
Xinzheng Dia Abrasives Co.,Ltd
Xinzheng Dia Abrasives Co.,Ltd
7
Home > Products > Grinding Wheel For Semiconductor And Photoelectricity >

Vitrified Dond Diamond Grinding Wheels With No Scratch And Chipping

Vitrified Dond Diamond Grinding Wheels With No Scratch And Chipping

Minimum Order Quantity 1PC
Price Negotiable
Payment Terms T/T
Supply Ability 20000 pcs per month capacity
Delivery Time 15-20 days delivery time
Packaging Details Box
Place of Origin China
Certification High QC standard, 100% inspection
Common Shape 6A2, 6A2T
Bond Vitrified
Application Semiconductor industry
Key word Back Thinning Wheels​
Grit size Coarse Grit: 270--800 Finish Grit: 2000--8000
Feature High efficiency
Detailed Product Description
Vitrified & Metal Bond Back Thinning Wheels​

 

The back thinning is performed by a wet grind process with a rust inhibitor for cooling the chips and keeping the grind wheel free of debris. The grinding wheel acts a very important role in the grinding process, a low quality grinding wheel will lead high reject rate.

 

 

Features:

 

  1. ​Good surface quality
  2. High efficiency
  3. No scratch
  4. No chipping
  5. Long using life

 

Specification:

 

 

Specifications:Application
Common ShapeWheel SizeGrit SizeClassic SpecificationIndustryWorkpiece&MaterialMachineBondWorking Data
6A2, 6A2T, 1A1OD: 175,195,209,305,255,355Coarse Grit: 270--800
Finish Grit: 2000--8000
6A2 175D 30T 76H
6A2 200D 35T 76H
6A2T 280D 30T 228.6H
1A1 40D 5T 18.7H
Semiconductor industrySapphire, silicon waferSHUWA, NTS, WEC, GALAXY. SPEEDFAM
DISCO, OKAMOTOI, TSK, G&N, STRASBAUGH, LAMPMASTER
Vitrified
Metal
 
Product Tags: pcd cutting tool blanks   pcd die blanks  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: Xinzheng Dia Abrasives Co.,Ltd
Subject:
Message:
Characters Remaining: (80/3000)