3A1 3A1R Grinding Wheel For Semiconductor And Photoelectricity Industry

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Xinzheng Dia Abrasives Co.,Ltd

Country/Region:china

Tel:86-371-8652-5960

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Minimum Order Quantity	1PC
Price	Negotiable
Payment Terms	T/T
Supply Ability	20000 pcs per month capacity
Delivery Time	15-20 days delivery time
Packaging Details	Box
Place of Origin	China
Certification	High QC standard, 100% inspection
Common Shape	3A1, 3A1R
Wheel Size	OD:10-200 T:0.07-2.0 H:6, 8, 12.7, 31.75,50.8"
Advantage:	high precision
Application	Semiconductor & Photoelectricity
Bond	Resin Metal
Grit size	3um-70um

Detailed Product Description

Metal & Resin Bond Dicing Blade

Ultra thin dicing blades are widely used in semiconducto industry

Features:

Specification:

Specifications:				Application
Common Shape	Wheel Size	Grit Size	Classic Specification	Industry	Workpiece&Material	Machine	Bond	Working Data
1A8, 1A1R	OD:10-200 T:0.07-2.0 H:6, 8, 12.7, 31.75,50.8	3um-70um		semiconductor industry optical glass industry optical communication	BGA, LGA, LED Blue glass, crystal, gem, filter quartz		Resin Metal

Product Tags: pcd cutting tool blanks pcd die blanks

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