G510LL Lead Free SMT PCB Laser Marking Machine For Assemly Line

G510LL Lead Free SMT PCB Laser Marking Machine For Assemly Line

PCB Laser Marking Machine G510HLL

Features of Laser Marking Machine

There are two accepted principles:

(1) "Heat processing" has a laser beam with a higher energy density (it is a concentrated energy flow) that irradiates the surface of the material to be processed. The surface of the material absorbs the laser energy and generates a thermal excitation process in the irradiated area, thereby making the surface of the material (or Coating) temperature rises, causing phenomena such as metamorphosis, melting, ablation, and evaporation.

(2) "Cold working" (ultraviolet) photons with very high load energy can break the chemical bonds in the material (especially organic materials) or the surrounding medium to cause the material to undergo non-thermal process damage. This kind of cold processing is of special significance in laser marking processing, because it is not thermal ablation, but cold peeling that does not produce the side effects of "thermal damage" and breaks chemical bonds, so it has no effect on the inner layer and nearby areas of the processed surface. Produce heating or thermal deformation. For example, in the electronics industry, excimer lasers are used to deposit thin films of chemical substances on base materials and to cut narrow grooves on semiconductor substrates.

Application field 

OPTION Internal PCB turnover system

OPTION Special double optical paths design

OPTION Three-sections rail conveyor

OPTION Up&down dual mode laser device