PLC 50mm PCB Reflow Solder Machine

Lead Free SMT Reflow Soldering Machine for Production Line RF-600I

Features

1. Automatically monitoring and displaying the working condition of the oven the parameter

    of the oven can be modified at any moment

2. Even temperature and high heat compensation efficiency,

    especially suitable for soldering of BGA CSP components.

3. All temperature zone applies coercive independent cycles PID controls and up & down heating style,

    which make the temperature of theoven accurate with a large heat capacity.

4. The upper cover of the oven is raised by electric handspike, safe and credible.

5. The guide rail is made of special aluminum alloy with high rigidity accuracy and intensity,

    with auto chain lubricating system

6. Quick warm up, it takes less than 20 minutes to heat fromthe normal temperature to the working temperature

7. Powerful programming software’s controlling system, it can detect the online temperature

    of PCB and can analysis save and print the profiles

8. SMEMA compatible

The Process of Reflow Oven

The reflow oven process is that when the circuit board with printed solder paste and good

components enters the reflow oven furnace, the circuit board is driven by the reflow oven

rail transport chain to pass through the preheating zone, heat preservation zone, soldering

zone and cooling zone of reflow oven in turn After the temperature changes of the four

temperature zones of reflow oven, the reflow oven process of the circuit board is completed.

The following specifically explains the soldering change process when the circuit board

passes through the four temperature zones of reflow oven in sequence.

Specifications

Package and Shippment