0.1mm Diamond Dicing Blades Without Matrix High Precision Cutting
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Super Hard Tools of Hi Precision Metal Sintered Diamond Dicing Blade
To abrasive or cut Semiconductor,Optical Glass, Ceramics, Magnetic Material etc. etc
Diamond wheel shape and indicates:
D -- Out Diameter H -- Inner Diameter W-- Thickness
Over 15 years of developing and producing experience in high precision super hard material tools, we have established a high efficiency system to provide stable performance wheel products.
We welcome yr free inquiry for any question in our diamond cutting wheels. In order to supply exact wheel type and quotatioon to you, if possible, better for you to provide us more information like followings:
1. Yr processing objects. 2. Yr OD, ID, Thickness data. 3. Grit size if possible. 4. Rotary speed of your processing machine.
Many Thanks.
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Product Tags: 0.1mm 50mm Semiconductor Diamond Dicing Blades 50mm 0.1mm Diamond Dicing Blades Semiconductor 0.1mm round cutting blades |