China Sic Heating Elements manufacturer
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
6
Home > Products > Sic Heating Elements >

Bump suction cup processing

Bump suction cup processing

Brand Name ZG
Model Number MS
Certification CE
Place of Origin China
Minimum Order Quantity 1 PC
Price 10USD/PC
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 1000 PCS
Delivery Time 5-8 work days
Packaging Details Strong wooden box for Global shipping
Detailed Product Description

 

Bump Suction Cupprocessing

Bumped suction cups, featuring raised, textured surfaces, are manufactured via precision injection molding using specialized molds to create intricate patterns for enhanced grip, with features as small as 0.3mm and high flatness tolerances (up to 0.03mm). These, often Alumina or SiC-bsed, improve vacuum stability in industrial, medical, and consumer electronics applications.

 

Key Aspects of Bump Suction Cup Processing:
 
 
  • Manufacturing Method: The suction cup main body is created by injecting synthetic resin into a cavity within a primary mold, allowing for customized surface textures.
  • Design Features: The bump structures are engineered to reduce contact area, enhancing anti-static properties, increasing wear resistance, and improving stability, particularly for handling delicate materials like wafers.
  • Materials & Performance: Materials include advanced ceramics like Alumina, which can be coated with Diamond-Like Carbon (DLC), or materials offering high, customizable flatness (down to 1um some cases)
  • Maintenance: Performance is maintained by avoiding excessive heat or chemical exposure and ensuring the surfaces remain clean.
 
 
 
 
 
 
 
 
 
Restoring Suction Cup Functionality:
If a suction cup loses its grip, it can be rejuvenated by boiling it for 2 to 5 minutes to restore its shape and elasticity, then allowing it to cool. Cleaning with warm water and soap also removes dirt that hinders suction.
 
 
 
 
 
 
ParameterindicatorMaximum sintering size
ApplicationWafer inspection, photolithography, etc.Diameter 400, height 500
Bump Diameter (Minimum)0.2mmDiameter 400, height 40
Flatness(φ350mm)300mm 
Parallelism3um 
Maximum panel size≤350mm 
MaterialsSilicon carbide, silicon nitride, aluminum nitride, aluminum oxide 

 


 

 

Product Tags: bump suction cup heating element   SIC heating element processing   suction cup heating element with warranty  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
Subject:
Message:
Characters Remaining: (80/3000)