Silicon Carbide Components For Semiconductor Equipment HuaCera silicon carbide has a thermal expansion coefficient that
matches that of silicon,and possesses a high elastic modulus, high
rigidity, chemical inertness, extremely high wear resistance, and
dimensional thermal stability. Using low-cost forming methods such as dry pressing and cold
isostatic pressing,while maintaining a high level of purity
(greater than 99.9%), it is an ideal choice for equipment used in
semiconductor lithography, wafer metrology, bonding, and cleaning processes. Main applications include: vacuum chucks, precision components
(guide rails, platforms, bases), silicon carbide mirrors, carriers,
robotic arms, and other structural components, and can also be used
as high-temperature furnace tubes. Basic characteristics - Good wear resistance and erosion resistance,
- High high temperature strength, good thermal shock stability,
- High thermal conductivity, small thermal expansion coefficient,
etc.
- It is a high-performance refractory material.
Typical applications - The main varieties include oxide-bonded silicon carbide bricks,
- carbon-bonded silicon carbide bricks,
- nitride-bonded silicon carbide bricks,
- self-bonded silicon carbide bricks,
- recrystallized silicon carbide bricks and semi-silicon carbide
bricks, etc.
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