China Sic Heating Elements manufacturer
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
5
Home > Products > Technical Ceramic Parts >

Diamond Heat Dissipation Material Thermal Management For Electronic Packaging Heat Dissipation

Diamond Heat Dissipation Material Thermal Management For Electronic Packaging Heat Dissipation

Brand Name ZG
Model Number MS
Certification CE
Place of Origin China
Minimum Order Quantity 1 PC
Price 10USD/PC
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 1000 PCS
Delivery Time 7 work days
Packaging Details Strong wooden box for Global shipping
Detailed Product Description

Diamond Heat Dissipation Material Thermal Management

 

Diamond single crystal and polycrystalline heat dissipation products have unique thermal conductivity characteristics, which can effectively solve the heat dissipation problem of electronic devices and meet the requirements of lightweight applications. They can be used in power, radio frequency devices, electronic packaging and heat dissipation, new energy vehicles, high-energy lasers and other fields. Diamond heat dissipation materials can be customized according to the user's cost/performance requirements.

 

 

 

 

 

 

Product Tags: Electronic Packaging Heat Dissipation Material   Diamond Heat Dissipation Material   Thermal Management Material  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
Subject:
Message:
Characters Remaining: (80/3000)