Diamond Tile, 3.0 Micron for Planarisation, Polishing, Thinning

A structured, fixed abrasive composite pad consisting of an inorganic abrasive (vitreous diamond agglomerates) in an organic binder (cross linked polymer) capable of lapping a multitude of substrates on varied equipment and processes

Applications: Planarisation, Polishing, Thinning

• Produces superior surface finish to slurry
• Reduces total process time
• Eliminates messy slurries
• Reduces waste disposal costs
• Elimates lap plate replacement
• Fits on any lapping machine
• Produces flatter parts with less edge rounding compared to slurries