China Sic Heating Elements manufacturer
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
5
Home > Products > Technical Ceramic Parts >

Higher Uniformity Thermal Oxide Wafer Excellent Dielectric Layer As An Insulator

Higher Uniformity Thermal Oxide Wafer Excellent Dielectric Layer As An Insulator

Brand Name ZG
Model Number MS
Certification CE
Place of Origin CHINA
Minimum Order Quantity 1 piece
Price USD10/piece
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability 10000 pieces per month
Delivery Time 3 working days
Packaging Details Strong wooden box for Global shipping
Application integrated circuits , detector / sensor device , MEMS fabrication, opto-electronic components, and solar cells
Diameter Ø 2" / Ø 3" / Ø 4" / Ø 6" / Ø 8" / Ø 12"
Oxide Thickness 100 A ~ 6 um
Grade Prime / Test / Dummy grade
Detailed Product Description

 

Thermal Oxide Wafer, higher uniformity, and higher dielectric strength , excellent dielectric layer as an insulator

 

Thermal oxide or silicon dioxide layer is formed on bare silicon surface at elevated temperature in the presence of an oxidant , the process is called thermal oxidation. Thermal oxide is normally grown in a horizontal tube furnace , at temperature range from 900°C ~ 1200°C , using either a "Wet" or "Dry" growth method . Thermal oxide is a kind of "grown" oxide layer , compared to CVD deposited oxide layer , it has a higher uniformity, and higher dielectric strength , it is an excellent dielectric layer as an insulator . In most silicon- based devices, thermal oxide layer play an important role to pacify the silicon surface to act as doping barriers and as surface dielectrics . we provides thermal oxide wafer in diameter from 2" to 12 " , we always choose prime grade and defect free silicon wafer as substrate for growing high uniformity thermal oxide layer to meet your specific requirements . Contact us for further information on price & delivery time .

 

Thermal Oxide Capability

Typically after thermal oxidation process , both front side and back side of silicon wafer have oxide layer . In case only one side oxide layer is required , we can remove back oxide and offer one side thermal oxide wafer for you .
 

Oxide thickness rangeOxidation techniqueWithin wafer
uniformity
Wafer to wafer
uniformity
Surface processed
100 Å ~ 500Ådry oxide+/- 5%+/- 10%both sides
600 Å ~ 1000Ådry oxide+/- 5%+/- 10%both sides
100 nm ~ 300 nmwet oxide+/- 5%+/- 10%both sides
400 nm ~ 1000 nmwet oxide+/- 3%+/- 5%both sides
1 um ~ 2 umwet oxide+/- 3%+/- 5%both sides
3 um ~ 4 umwet oxide+/- 3%+/- 5%both sides
5 um ~ 6 umwet oxide+/- 3%+/- 5%both sides

Thermal Oxide Wafer Application

 

100 ATunneling Gates
150 A ~ 500 AGate Oxides
200 A ~ 500 ALOCOS Pad Oxide
2000 A ~ 5000 AMasking Oxides
3000 A ~ 10000 AField Oxides

 

Product Specification

 
Qxidation techniqueWet oxidation or Dry oxidation
DiameterØ 2" / Ø 3" / Ø 4" / Ø 6" / Ø 8" / Ø 12"
Oxide thickness100 A ~ 6 um
Tolerance+/- 5%
SurfaceSingle side or double sides oxide layer
FurnaceHorizontal tube furnace
GaseHydrogen and Oxygen gases
Temperature900 C ° - 1200 C °
Refractive index1.456

 

Product Tags: Higher Uniformity Thermal Oxide Wafer   Thermal Oxide Wafer as Insulator   2" thermal oxide silicon wafer  
Related Products
Email to this supplier
 
From:
Enter your Email please.
To: HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
Subject:
Message:
Characters Remaining: (80/3000)