High-performance silicon nitride ceramic materials developed for the aluminum industry has significantly improved
thermal and mechanical properties than similar products. On this
basis, the "L-shaped high thermal conductivity submerged heating
"Appliance" will bring revolutionary progress to aluminum
industrial equipment.
Special structural parts with high requirements for thermal shock
resistance are areas where silicon nitride ceramic materials can be
vigorously developed in the future. In application areas with high
temperature, strong corrosion, and high wear resistance, silicon
nitride ceramics are used to replace some cemented carbide,
alumina, Materials such as zirconia and silicon carbide will become
a trend.
Silicon Nitride Related Data
Main component | 99%Al2O3 | S-SiC | ZrO2 | Si3N4 |
|
Physical Property | Density | g/cm3 | 3.9 | 3.1 | 6 | 3.2 |
Water Absorption | % | 0 | 0.1 | 0 | 0.1 |
Sinter Temperature | °C | 1700 | 2200 | 1500 | 1800 |
Mechanical Property | Rockwell Hardness | HV | 1700 | 2200 | 1300 | 1400 |
Bend Strength | kgf/mm2 | 3500 | 4000 | 9000 | 7000 |
Compression Intensity | Kgf/mm2 | 30000 | 20000 | 20000 | 23000 |
Thermal Property | Maximum working temperature | °C | 1500 | 1600 | 1300 | 1400 |
thermal expansion coefficient 0-1000°C | /°C | 8.0*10-6 | 4.1*10-6(0-500°C) | 9.5*10-6 | 2.0*10-6(0-500°C) |
5.2*10-6(500-1000°C) | 4.0*10-6(500-1000°C) |
Thermal Shock resistance | T(°C) | 200 | 250 | 300 | 400-500 |
Thermal Conductivity | W/m.k(25°C | 31 | 100 | 3 | 25 |
300°C) | 16 | 100 | 3 | 25 |
Electrical Property | Resisting rate of Volume | ◎.cm | | | | |
20°C | >1012 | 106-108 | >1010 | >1011 |
100°C | 1012-1013 | – | – | >1011 |
300°C | >1012 | – | – | >1011 |
Insulation Breakdown Intensity | KV/mm | 18 | semiconductor | 9 | 17.7 |
Dielectric Constant (1 MHz) | (E) | 10 | – | 29 | 7 |
Dielectric Dissipation | (tg o) | 0.4*10-3 | – | – | – |