microelectronic component alignment trays

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Shenzhen Hiner Technology Co., Ltd.

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:+1-(408)-669-7847

Contact Person:
Ms.Zhu View Contact Details

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microelectronic component alignment trays

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Anti-Static Bare Die Tray For Chip Scale Packages With High Temperature Resistance

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Waffle Box Anti-Static Bare Die Trays With Chip Scale Packages

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4 Inch Chip Tray With Stackable Chip Die Holders In Black Customizable

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2-inch Injection Mold Bare Die Tray With High Temperature Resistance For Clean Class General And Ultrasonic Cleaning

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Precision Machining Bare Die Trays For Transport And Customized Service By Injection Moulding

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Compact Grid Tray for Bare Die Storage in Semiconductor Facilities

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Heat Resistant ESD-Proof Tray For Chip Module Packaging And Secure Handling Property ESD Or Non-ESD

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PC Small Cavity Tray for Safe Transport of Semiconductor Bare Dies Optional Lid and Clip 2-inch 4-inch Optional

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2-inch 4-inch Optional Small Tray For IC Chip Handling Across Packaging And Inspection Clean Class General And Ultrasonic Cleaning

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Secure Packaging Solution ABS Bare Die Tray With Optional Lid And Clip

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