jedec electronic component tray

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Shenzhen Hiner Technology Co., Ltd.

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:+1-(408)-669-7847

Contact Person:
Ms.Zhu View Contact Details

261 - 270 of 354

jedec electronic component tray

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Flexible Customized Tray Pocket Size 25.76.40.41mm Chip Tray White ABS Semiconductor Chip Loading Tray

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IC Packaging BGA IC Type JEDEC IC Trays Black MPPO PPE ABS PEI IDP Material

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IC Packaging JEDEC IC Trays Surface Resistant Black Color 7.62mm Height

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7.62mm Height JEDEC IC Trays With MPPO PPE ABS PEI IDP For BGA IC Type

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Rectangular JEDEC IC Trays Simplified IC Packaging Solutions Height 7.62mm

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JEDEC Design Tray Pocket Size 11.9316.54.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP

*, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;... 2025-08-22 10:57:05

Semiconductor Industry Use Customizable Standard High Temperature BGA Package JEDEC Trays

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Standard Custom JEDEC Trays For Secure IC Packaging Mett Special Requirements

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Black JEDEC Tray for BGA-Packaged Chip Complies With Standard Design Matrix 8x16=128PCS

*, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line-height: 1.5;-webkit-font-smoothing: antialiased;... 2025-06-25 18:00:35

Rohs Compliant Custom JEDEC Trays The Ultimate Packaging Solution For ESD-Sensitive Items

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