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Shenzhen Hiner Technology Co., Ltd.
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ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

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Shenzhen Hiner Technology Co., Ltd.

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:+1-(408)-669-7847

Contact Person:
Ms.Zhu
View Contact Details

ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

Minimum Order Quantity 500 pcs
Delivery Time 10 workdays
Incoterms EXW, FOB, CIF, DDU, DDP
Ic Type BGA,QFP,QFN,LGA,PGA
Model Number HN24194
Mold Type Injection
Capacity 17x24=408 PCS
Payment Terms T/T
Color Black
Cavity Size 1.58x0.85x0.7 mm
Price $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
Quality Assurance Delivery Guarantee, Reliable Quality
Supply Ability 2000PCS/Day
Tray Weight Varies, Typically Up To 500 Grams Per Cavity
Outline Line Size 50.7×50.7×4 mm
Tray Shape Rectangular
Certification ROHS, ISO
Brand Name Hiner-pack
Reusable Yes
Place of Origin China
Clean Class General And Ultrasonic Cleaning
Packaging Details CARTON, PALLET
Packing Level Transport package
Warpage Warpage MAX 0.22mm
Detailed Product Description
ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage
Deliver precise waffle structure to cradle delicate IC chips tightly, preventing movement and electrostatic damage during handling. Crafted from durable anti-static material to maintain consistent performance in industrial environments, offering reliable protection for sensitive semiconductor components.

Integrate seamlessly with automated production lines and clean manufacturing workflows, performing steadily in chip loading, transfer, and inventory management procedures. Adapt flexibly to diverse semiconductor manufacturing scenarios, supporting efficient production and logistics operations.

Support full customization of cavity size and layout to match unique chip dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard IC chips throughout transit and storage.
Key Features/ Benefits 
  • Durable construction
  • Precision cavity layout
  • Durable construction
  • Secure chip holding
  • ESD-safe protection
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
BrandHiner-pack
ModelHN24194
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size50.7×50.7×4 mm
Cavity Size1.58x0.85x0.7 mm
Matrix QTY17x24=408 PCS
WarpageMAX 0.22mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Suitable for high-precision chip processing, component sorting, device testing, and small device assembly. Work well in automatic production lines and static-controlled workshops.

Ideal for factory internal transportation, finished product storage, and cross-regional goods delivery. Widely used in chip manufacturing, packaging plants, and electronic component suppliers.
Customized Services
Provide fully customized solutions for waffle pack chip trays. Adjust cavity size, spacing, and layout to fit diverse chip dimensions.

Leverage durable anti-static material for enhanced protection. Offer prototype testing and personalized design support to meet unique production and packaging needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
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