PC Waffle Pack Chip Trays For Optoelectronics Industry Loaded

PC Waffle Pack Chip Trays For Optoelectronics Industry Loaded

Customized Waffle Pack For Optoelectronics Industry Loaded With Microlenses

Waffle pack is widely used in semiconductor, photoelectric industry customers of the product requires a high degree of cleanliness and size, we from the design drawings, mold manufacturing, product manufacturing to cleaning packing and so on, all of the steps and operations through strict quality control, to deliver the ultimate goal of customer satisfaction for product, continuously meet the customer's requirements, To promote our factory to a higher level of progress.

Waffle pack compared with other method has many advantages, it can be placed not only very tiny components or parts, and the flexibility to match the lid and clip to raise product real ease of use, can satisfy the customer the different demand for samples and production loading respectively, at the same time can also be applied to automated production, easy to use and save the packaging cost.

Advantages:

1. Have exported for more than 10 years.
2. Have a professional engineer and efficient management.
3. Delivery time is short, normally in stock.
4. A small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to the USA, Germany, the UK, Europe, Korea, Japan, etc.
7. The factory has an ISO certificate. The product complies to Rohs standard.

Application: 

IC, Electronic component, Semiconductor Micro and Nano systems, and Sensor IC, etc.

FAQ:

1. How can I get a quotation?
Reply: Please provide the details of your requirements as clearly as possible. So we can send you the offer for the first time.
For purchasing or further discussion, it is better to contact us via Skype / Email / Phone / WhatsApp, in case of any delays.

2. How long will it take to get a response?
Reply: We will reply to you within 24 hours of the working day.

3. What kind of service do we provide?
Reply: We can design IC Tray drawings in advance based on your clear description of the IC or component. Provide one-stop service from design to packaging and shipping.
4. What are your terms of delivery?
Reply: We accept EXW, FOB, CIF, DDU, DDP, etc. You can choose the one that is the most convenient or cost-effective for you.

5. How to guarantee quality?
Reply: Our samples through strict testing, and the finished products comply with the international JEDEC standards, to ensure a 100% qualified rate.

For more information, please contact our sales department.

Hiner-Pack 4 Inch Waffle Pack Catalogue.pdf