PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution
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Waffle Pack Chip Tray Series For LED Chips Packaging Solution
To protect IC or conponents during shipments, It is critically important to choose the right supply form and packaging.Movement of the product within the container, contact with upper surfaces, electrostatic discharge (ESD), or exposure to air can damage the product.
Hiner-pack offers a wide selections of products to meet your specific bare die, chip scale, package shipping and handling needs. As packaging experts, we can help you choose the waffle pack that best meets your manufacturing needs while protecting your bare die from corrosion and ESD.
Details Of HN21131 Chip Tray
The HN21131 waffle pack is mainly made of PC. The material has good stability and can protect customers' electronic products well. The matrix design of 18*15-16 can also load more customers' products. In addition, multiple trays can overlap, increasing the storage of products and saving shipping costs.
Application Of HN21131 Chip Tray
Electronic Components Semiconductor Embedded System Micro and Anon System
Advantages 1. Light weight, saving transportation and packaging costs.
FAQ
Q1: Are You Manufacturer or Trade Company? Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China. Q2: What is the material of your product? Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc Q3. Can I order if quantity less than MOQ? Q5: Could you put my logo in our product? Q6. Do you arrange shipment for the products? Ans:It’s depends on our incoterms.If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.
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| Product Tags: Injection Moulding Waffle Packs Tray PC Material Waffle Pack Tray LED Chips Waffle Pack Tray | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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