Tiny Modules 4 Inch Waffle Pack Chip Trays ESD Stable Anti Static

Tiny Modules 4 Inch Waffle Pack Chip Trays ESD Stable Anti Static

Customized high-temperature resistant Waffle Pack for carrying tiny modules

Hiner-pack production IC tray is in line with international environmental standards, through the ROHS and SGS third party inspection, such as raw material of the raw material buying from domestic leading manufacturer, incoming inspection and related technology and strictly control the quality during production, quality department must confirm the product 100% qualified before shipment, are sold to domestic and international famous customers over the years, After the use of positive feedback, rich experience in injection molding industry also provides customers with the most appropriate packaging solutions.

Application:

 • Wafer Die / Bar / Chips

 • PCBA module component
 • Electronic component packaging

 • Optical device packaging

Technical Parameters:

FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value, and all samples shipping costs are normally is by collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, or by express, by mail, post, according to customer order quantity and volume.