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Shenzhen Hiner Technology Co., Ltd.
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Antistatic Waffle Pack Chip Trays IC Packaging Protecting CSP

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Shenzhen Hiner Technology Co., Ltd.

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:+1-(408)-669-7847

Contact Person:
Ms.Zhu
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Antistatic Waffle Pack Chip Trays IC Packaging Protecting CSP

Brand Name Hiner-pack
Model Number HN21038
Certification ISO 9001 ROHS SGS
Place of Origin Made In China
Minimum Order Quantity 1000 pcs
Price $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Payment Terms T/T
Supply Ability The capacity is between 4000PCS~5000PCS/per day
Delivery Time 5~8 working days
Packaging Details It depends on the QTY of order and size of product
Material ABS
Color Black
Property ESD
Design Non-standard
Size 2 Inch
Surface Resistance 1.0x10E4~1.0x10E11Ω
Clean class General And Ultrasonic Cleaning
Incoterms EXW,FOB,CIF,DDU,DDP
Injection Mold Lead Time 20~25Days,Mold Life Span: 30~450,000 Times
Molding Method Injection Moulding
Detailed Product Description

Antistatic Waffle Pack Chip Trays IC Packaging Protecting CSP

 

Anti-Static Chip Tray With Digital Array Specially Designed For The Cavity

 

 

The use of anti-static tray storage electronic components, can effectively avoid short circuit phenomenon.Because the product is prone to friction in the process of placement and transportation, if there is some static electricity on the circuit board of the product, it is easy to lead to short circuit of the circuit board, affecting the quality of the product, and may even cause damage.

 

Chip tray is a carrier for bare dies used for the transportation and handling of a small batch of dies. A waffle pack is typically a plastic tray with pockets sized up for a particular die size.
 
IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).

 

Chinese Professional Manufacturer

 

1. Ten years experience in the ESD tray Field
2. Adequate Supply of products
3. Professional non-standard custom
4. MPPO.PPE.ABS.PEI.IDP...etc material
5. Products follow the JEDEC antistatic standard.
7. The tray is permanent unitary antistatic, cut off the headstream of the static threat of the products.

 

Detail Information

 

Outline SizeMaterialSurface ResistanceServiceFlatnessColor
2"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.2mmCustomizable
3"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.25mmCustomizable
4"ABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMMax 0.3mmCustomizable
Custom sizeABS.PC.PPE...etc1.0x10e4-1.0x10e11ΩOEM,ODMTBCCustomizable
Provide professional design and packaging for your products
Outline Line Size50*50*5mmBrandHiner-pack
ModelHN21038Package TypeIC Parts
Cavity Size7.5X6X1.2mmMatrix QTY5*5=25PCS
MaterialABSFlatnessMAX 0.2mm
ColorBlackServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS

 

Product Application

 

Wafer Die / Bar / Chips                     PCBA module component

Electronic component packaging      Optical device packaging

 


Packaging


Packing according to customer's specified size

FAQ

 

Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

Product Tags: Antistatic Waffle Pack Chip Trays   CSP Waffle Pack Chip Trays   CSP waffle pack trays  
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