China Hot Melt Film manufacturer
Guangdong Jinhonghai New Material Technology Co., Ltd
1. Quality first 2. Customer first 3. Excellent service 4. Keep the contract
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dtf hot melt powder

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Guangdong Jinhonghai New Material Technology Co., Ltd

City: dongguan

Province/State:guangdong

Country/Region:china

Tel:86--13192099222

Contact Person:
Mr.LIN
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dtf hot melt powder

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...Hot Melt Adhesive Powder is a high performance hot melt powder adhesive designed to offer excellent bonding properties. It is composed of ... 2026-04-29 00:17:00
...16KG)(g/ 10min), composition of PA, bonding pressure of 1.0-3.0kg/c㎡, melt point of 75-85°C and bonding time of 8-12Sec. It has been widely used in ... 2025-04-07 10:34:49
...Hot Melt Adhesive Powder is a special powder that offers superior hot melt properties for a range of applications. It is made of polyamide (PA) and ... 2026-04-29 00:17:00
...Hot Melt Adhesive Powder is an ideal solution for various bonding needs. It is made of TPU, providing excellent resilience, good thermal stability ... 2026-04-29 00:17:00
... a soft touch to the surfaces it is applied to. This product is suitable for printing textiles, leather, paper, wood and other materials. It has a ... 2026-04-29 00:17:00
..., paper, wood, etc. It is a high-quality hotmelt adhesive powder that comes with a dry-cleaning property for easy and hassle-free usage. It has an ... 2026-04-29 00:17:00
...a good melting point of 50-60°C and a melt flow index of 20-30. This powder has good adhesive properties and can be used in a wide variety of ... 2026-04-29 00:17:00
...Hot Melt Adhesive Powder is composed of TPU, which is white in color and has a melt point of 100-110°C and a melt flow index of 16-20. It offers a ... 2026-04-29 00:17:00
... of 1.0-3.0kg/c㎡, bonding temperature of 85-105°C, and composition of TPU. It is a white powder with a product name of Hot Melt Adhesive Powder. It ... 2026-04-29 00:17:00
...Hot melt adhesive powder is a type of thermoplastic material with superior adhesion and flexibility. It is an ideal choice for bonding applications ... 2026-04-29 00:17:00
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