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OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

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Beijing Haina Lean Technology Co., Ltd

City: beijing

Province/State:beijing

Country/Region:china

Tel:86--13722988404

Contact Person:
Miss.Marina View Contact Details

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

Brand Name	HNL-PCBA
Model Number	PCBA-01
Certification	ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000
Place of Origin	CHINA
Minimum Order Quantity	1 PC
Price	Negotiable
Payment Terms	T/T, Western Union, L/C, MoneyGram
Supply Ability	10,000,000 Point /Day
Delivery Time	1-7days
Packaging Details	ESD packaging with carton box
Product name	Printed Circuit SMT Board Assembly
Copper thickness	1/3oz-6oz
Min. line spacing / Width	0.030mm / 0.030mm
Board thickness	0.3-3.5mm
Min. hole size	Laser 0.05mm ; Mechnical 0.15
Solder mask color	Blue.green.red.black.white.etc
Surface finishing	HASL,OSP,ENIG,HASL Lead Free,Immersion Gold
Material	FR4 /Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
Application	Communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics
Assembly Types	Surface mount, Thro-hole, Mixed technology (SMT & Thru-hole), Single or double sided placement, Conformal coating, Shield cover assembly for EMI emission control

Detailed Product Description

OSP 6 Layer 3 Mil Printed Circuit SMT Board Assembly For High Speed Railway

Printed Circuit SMT Board Assembly Introduction

Haina lean Electronics is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing and PCB assembly.
The company is specialized in electronic products supporting processing services, mainly to undertake circuit board design, layout production, components procurement, PCB plate making, circuit board welding assembly debugging and other OEM/ODM services.

Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .

PCB CAPABILITIES

No.	Items
1	HDI Capabilities	HDI ELIC(5+2+5)
2	Max layer count	36L
3	Board Thickness	Core thickness 0.05mm-1.5mm ,Fineshed board thickness0.3-3.5mm
4	Min.Hole Size	Laser 0.05mm
4	Min.Hole Size	Mechnical 0.15
5	Min Line Width/Space	0.030mm/0.030mm
6	Copper Thickness	1/3oz-6oz
7	Size Max Panel size	700x610mm
8	Registration Accuracy	+/-0.05mm
9	Routing Accuracy	+/-0.05mm
10	Min.BGA PAD	0.125mm
11	Max Aspect Ratio	10:01
12	Bow and Twist	0.50%
13	Impedance Control Tolerance	+/-5%
14	Daily output	4,000m2 (Max capacity of equipment)
15	Surface Finishing	ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16	Raw Material	FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

PCBA CAPABILITIES

PCBA Capability
Material Type	Item	Min	Max
PCB	Dimension (length,width,height.mm)	50400.38	6004004.2
	Material	FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
	Surface finish	HASL,OSP,Immersion gold,Flash Gold Finger
Components	Chip&IC	1005	55mm
	BGA Pitch	0.3mm	-
	QFP Pitch	0.3mm	-

Our advantage

Service value

Independent quotation system to quickly serve the market

PCB manufacturing

High-tech PCB and PCB assembly production line

Material purchasing

A team of experienced electronic component procurement engineers

SMT post soldering

Dust-free workshop, high-end SMT patch processing

Delivery Time

Product Type	Qty	Normal lead time	Quick-turn lead time
SMT+DIP	1-50	1WD-2WD	8H
SMT+DIP	51-200	2WD-3WD	1.5WD
SMT+DIP	201-2000	3WD-4WD	2WD
SMT+DIP	≥2001	4WD-5WD	3WD
PCBA(2-4Layer)	1-50	2.5WD-3.5WD	1WD
PCBA(2-4Layer)	51-2000	5WD-6WD	2.5WD
PCBA(2-4Layer)	≥2001	≥7WD	5WD
PCBA(6-10Layer)	1-50	3WD-4WD	2.5WD
PCBA(6-10Layer)	51-2000	7WD-8WD	6WD
PCBA(10-HDILayer)	1-50	7WD-9WD	5WD
PCBA(10-HDILayer)	51-2000	9WD-11WD	7WD

Printed Circuit SMT Board Assembly Application Field

Assembled Printed Circuit Boards are mainly used for many communication industry, medical equipments, consumer electronics and automobile industry ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer etc industries.

Workshop

Partners

Common packaging

PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

Product Tags: 6 Layer SMD PCB Assembly 3 Mil SMD PCB Assembly OSP SMT PCBA

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OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

OSP 6 Layer 3 Mil Printed Circuit SMT Board Assembly For High Speed Railway

Printed Circuit SMT Board Assembly Introduction

PCB CAPABILITIES

PCBA CAPABILITIES

Our advantage

Delivery Time

Printed Circuit SMT Board Assembly Application Field

Workshop

Partners

Common packaging

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