High-Performance RO4533 PCB 20mil 2-Layer Low-Loss Solution

This 2-layer rigid RF PCB is built with Rogers RO4533—a ceramic-filled, glass-reinforced hydrocarbon material—and features an Immersion Gold surface finish. Complying with IPC-Class 2 quality standards, this PCB provides consistent and reliable performance for critical applications such as cellular infrastructure base station antennas and WiMAX antenna networks. With a focus on low loss, dimensional stability, and compatibility with standard manufacturing processes, it stands out as the best choice for engineers and procurement teams seeking an affordable, high-performance substrate for mobile infrastructure microstrip antenna projects.

PCB Specifications

PCB Stack-up Configuration

RO4533 Substrate: The Key to Low-Loss, High-Performance Antenna Solutions

Rogers RO4533 laminate is the cornerstone of our PCB’s exceptional performance, specifically engineered to meet the demands of mobile infrastructure microstrip antenna applications:

Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon-based materials that deliver the controlled dielectric constant, low-loss performance, and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications. These laminates are fully compatible with conventional FR-4 and high-temperature lead-free solder processing, eliminating the need for the special treatment required by traditional PTFE-based laminates for plated through-hole preparation. As an affordable alternative to more conventional PTFE antenna technologies, RO4533 enables designers to balance the price and performance of their antennas. Furthermore, RO4533 laminates are available in halogen-free versions to meet the most stringent “green” environmental standards.

The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for optimal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper, which reduces stresses in the printed circuit board antenna. The typical glass transition temperature of RO4533 materials exceeds 280°C (536°F), leading to a low Z-axis CTE and excellent plated through-hole reliability.

Key Features of RO4533 PCB

RO4533 offers outstanding electrical and mechanical features specifically tailored for mobile infrastructure antenna applications, including:

Dielectric Constant (Dk): 3.3 at 10GHz – Ensures controlled, stable signal propagation for antenna applications

Dissipation Factor: 0.0025 at 10GHz – Low dielectric loss, which is critical for preserving signal integrity and antenna efficiency

Coefficient of Thermal Expansion (CTE): X-axis 13ppm/°C, Y-axis 11ppm/°C, Z-axis 37ppm/°C – Copper-matched X/Y CTE reduces thermal stress in antenna PCBs

Glass Transition Temperature (Tg): >280°C – Supports high-temperature processing and reliable operation in harsh environments

Low Moisture Absorption: 0.02% – Enhances reliability in humid operating conditions, making it ideal for outdoor antenna deployments

Thermal Conductivity: 0.6 W/mK – Facilitates efficient heat dissipation, improving power handling for antenna systems

Key Benefits of RO4533 PCB

The RO4533 substrate offers numerous advantages for engineers and manufacturers of mobile infrastructure antennas, including:

Low Loss, Low Dk, and low PIM response – Suitable for a wide range of mobile infrastructure antenna applications

Thermoset resin system – Compatible with standard PCB fabrication processes, reducing manufacturing complexity and costs

Excellent dimensional stability – Delivers higher yields on larger panel sizes, optimizing production efficiency

Uniform mechanical properties – Maintains its mechanical form during handling, ensuring consistent antenna performance

High thermal conductivity – Improves power handling capabilities, enhancing the reliability of antennas in high-power applications

Applications

Our RO4533 2-layer RF PCB is specifically engineered for low-loss, high-performance mobile infrastructure applications, including:

-Cellular infrastructure base station antennas

-WiMAX antenna networks

Artwork Format & Availability

Artwork Format: Supplied in Gerber RS-274-X – The industry-standard format for PCB manufacturing, ensuring compatibility with all major design and fabrication software and guaranteeing reliable production.

Availability: Worldwide – We offer global shipping to meet the needs of engineers and manufacturers around the world, with delivery times that comply with industry standards.