F4BME220 is manufactured through precise processes using fiberglass
cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. It
exhibits superior electrical properties compared to standard F4B,
including a broader dielectric constant range, lower dielectric
loss, higher insulation resistance, and enhanced stability, making
it a viable alternative to comparable international products.
The dielectric layers of F4BM220 and F4BME220 are identical, but
they employ different copper foils: F4BM220 uses ED copper foil and
is intended for applications where PIM is not specified; F4BME220
utilizes reverse-treated RTF copper foil, delivering excellent PIM
performance, more accurate circuit control, and reduced conductor
loss.
Both F4BM220 and F4BME220 allow precise adjustment of the
dielectric constant by modifying the ratio of PTFE to fiberglass
cloth. This optimization achieves low signal loss while improving
dimensional stability. A higher dielectric constant corresponds to
a greater fiberglass content, resulting in better dimensional
stability, a lower coefficient of thermal expansion, improved
temperature drift characteristics, and a moderate increase in
dielectric loss.
Product Features:
- Dielectric constant (Dk) options from 2.2
- Low loss characteristics
- F4BME with RTF copper foil provides excellent PIM performance
- Variety of dimensions to reduce material waste and cost
- Radiation-resistant with low outgassing
- Commercially available in volume at a competitive price
Typical Applications:
- Microwave, RF, and radar systems
- Phase shifters and passive components
- Power dividers, couplers, and combiners
- Feed networks and phased array antennas
- Satellite communications and base station antennas
| Product Technical Parameters | Product Model & Data Sheet |
| Product Features | Test Conditions | Unit | F4BME220 |
| Dielectric Constant (Typical) | 10GHz | / | 2.2 |
| Dielectric Constant Tolerance | / | / | ±0.04 |
| Loss Tangent (Typical) | 10GHz | / | 0.001 |
| 20GHz | / | 0.0014 |
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -142 |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 |
| 1 OZ F4BME | N/mm | >1.6 |
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 |
| Thermal Stress | 260℃, 10s,3 times | No delamination |
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 |
| Density | Room Temperature | g/cm3 | 2.18 |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 |
| PIM | Only applicable to F4BME | dBc | ≤-159 |
| Flammability | / | UL-94 | V-0 |
| Material Composition | / | / | |
