RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

Browse Categories

Bicheng Electronics Technology Co., Ltd

City: shenzhen

Province/State:guangdong

Country/Region:china

Tel:86-755-27374847

Contact Person:
Ms.Ivy Deng View Contact Details

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

Brand Name	Bicheng
Model Number	BIC-332.V1.0
Certification	UL, ISO9001, IATF16949
Place of Origin	CHINA
Minimum Order Quantity	1PCS
Price	USD9.99-99.99
Payment Terms	T/T
Supply Ability	5000PCS per month
Delivery Time	8-9 working days
Packaging Details	Vacuum bags+Cartons
Base material	Rogers RO4360G2
Layer count	2 layers
PCB thickness	0.9mm
PCB size	73.12mm x 44.71mm per piece (1PCS),
Silkscreen	White
Solder mask	Green
Copper weight	1oz (1.4 mils) for outer layers
Surface finish	Immersion Gold

Detailed Product Description

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

Leveraging Rogers RO4360G2, a low-loss, glass-reinforced hydrocarbon ceramic thermoset material, this 2-layer rigid PCB is purpose-built for high-frequency telecom applications—specifically base station power amplifiers and small cell transceivers.

PCB Specification

Parameter	Details
Base Material	Rogers RO4360G2 - Low-loss, glass-reinforced hydrocarbon ceramic thermoset; first high-Dk thermoset laminate processable like FR-4
Layer Count	2 layers (rigid structure)
Board Dimensions	73.12mm x 44.71mm per piece (1PCS)
Minimum Trace/Space	5 mils (trace) / 6 mils (space)
Minimum Hole Size	0.30mm
Vias	No blind vias; via plating thickness = 20 μm - Ensures low
Finished Board Thickness	0.9mm
Finished Copper Weight	1oz (1.4 mils) for outer layers
Surface Finish	Immersion Gold
Silkscreen	White silkscreen on top layer; no silkscreen on bottom layer
Solder Mask	Green solder mask on top layer; no solder mask on bottom layer
Quality Assurance	100% electrical testing prior shipment

PCB Stack-up

The stack-up is engineered to maximize RF performance and thermal reliability, leveraging RO4360G2's high Dk and copper-matched thermal expansion:

Layer Name	Material	Thickness
Top Layer (Copper_layer_1)	35 μm thick copper	35 μm (1oz)
Substrate Layer	Rogers RO4360G2	0.813mm (32mil)
Bottom Layer (Copper_layer_2)	35 μm thick copper	35 μm (1oz)

Rogers RO4360G2 Material Introduction

Rogers RO4360G2 redefines high-Dk telecom material design by solving a key industry challenge: high performance without specialized processing. As the first high-Dk thermoset laminate processable like standard FR-4, it eliminates the need for costly, time-consuming fabrication steps (e.g., sodium etch for PTFE materials) while delivering the RF properties required for power amplifiers and transceivers.

Glass Reinforcement: Adds rigidity for easier handling in multi-layer constructions (and compatible with RO440 series prepreg/RO4000 low-Dk laminates for complex designs)
Lead-Free Compatibility: Aligns with global environmental regulations (e.g., RoHS) for telecom equipment
Cost Efficiency: Short lead times and efficient supply chains reduce material and production costs—critical for large-scale base station rollouts

Key Material Features

Feature	Specification
Dielectric Constant (Dk)	6.15 ± 0.15 at 10GHz/23°C
Dissipation Factor (DF)	0.0038 at 10GHz/23°C
Thermal Performance	- Decomposition Temp (Td): >407°C - Glass Transition Temp (Tg): >280°C (TMA)
Thermal Conductivity	0.75 W/mK
Coefficient of Thermal Expansion (CTE)	- X-axis: 13 ppm/°C - Y-axis: 14 ppm/°C - Z-axis: 28 ppm/°C (-55 to 288°C)
Flammability Rating	UL 94 V-0
Process Compatibility	Lead-free process compatible; FR-4-like fabrication

Core Benefits

High RF Efficiency: High Dk (6.15) enables compact RF circuit designs (critical for small cell transceivers) while low DF (0.0038) minimizes signal loss in power amplifiers
Plated Through-Hole (PTH) Reliability: Low Z-axis CTE (28 ppm/°C) and copper-matched X/Y CTE prevent PTH cracking during thermal cycling.
Automated Assembly Compatibility: FR-4-like processing works with standard SMT and thru-hole assembly lines, reducing production time for high-volume telecom orders.
Thermal Resilience: High Tg (>280°C) and Td (>407°C) withstand lead-free soldering and the heat generated by power amplifiers, preventing component failure.
Environmental Compliance: Lead-free and UL 94 V-0 rated, meeting global telecom safety and sustainability standards.

Some Typical Applications

Base Station Power Amplifiers
Small Cell Transceivers

The 2-layer PCB with Rogers RO4360G2 material is a telecom-optimized solution that bridges high performance and practicality.

Product Tags: RO4360G2 PCB 2 layer Rogers PCB immersion gold finish 32mil substrate PCB board

Related Products

Rogers TMM10i PCB 2-Layer 30mil Laminate High Dk Circuit Board for sale


From:	Enter your Email please. Your email is incorrect!
To:	Bicheng Electronics Technology Co., Ltd
Subject:	Subject is empty!
Message:	Characters Remaining: (80/3000) Please enter 20 to 3000 characters to contact this supplier!

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish

Rogers TMM10i PCB 2-Layer 30mil Laminate High Dk Circuit Board

2-layer PCB Rogers RO3006 5mil High Stability Ceramic Filled RF PCB

10mil Rogers CuClad 250 PCB Immersion Gold Finish Low-Dk

6-layer RO4003C PCB 1.74mm Thick High TG Circuit IPC-Class-3

RT/Duroid 5870 Rogers PCB Board

Rogers 5870 Multilayer UL Rogers PCB Board Glass Microfiber Reinforced PTFE